Ọja Name:Tantalum target material
Ite: Ta1.Ta2.TaW2.5.TaW10.
Standard:GB/3629-2006
Mimọ:≥99.95%
Condition: annealed (M.) or hard (Y)
Iwọn:
Opin ode (mm) | Sisanra (mm) | Ailewu dada | Irọrun |
50~ 400 | 3~ 50 | 32Rms | ≤0.15% |
Akiyesi: Awọn ọja pataki nilo lati ni adehun iṣowo laarin ipese ati ibeere. |
Awọn ibeere eroja:
Brand | Akoonu eroja (ida ibi- %) | |||||||||||
C. | N | O | H | Fe | Ati | Ni | Iwọ | Mo | W | Nb | Ta | |
Ta1 | 0.01 | 0.005 | 0.015 | 0.0015 | 0.005 | 0.005 | 0.002 | 0.002 | 0.01 | 0.01 | 0.05 | Awọn iyokù |
Ta2 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.02 | 0.005 | 0.005 | 0.03 | 0.04 | 0.1 | Awọn iyokù |
TaNb3 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.03 | 0.005 | 0.005 | 0.03 | 0.04 | 1.5~ 3.5 | Awọn iyokù |
TaNb20 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.03 | 0.005 | 0.005 | 0.02 | 0.04 | 17~ 23 | Awọn iyokù |
TaNb40 | 0.01 | 0.01 | 0.02 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 0.05 | 35~ 42 | Awọn iyokù |
TaW2.5 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 2.0~ 3.5 | 0.5 | Awọn iyokù |
TaW7.5 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 6.5~ 8.5 | 0.5 | Awọn iyokù |
TaW10 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 9.0~ 11 | 0.1 | Awọn iyokù |
Ohun elo: Tantalum sputtering afojusun jẹ iwe tantalum ti a gba nipasẹ ṣiṣe titẹ, pẹlu mimo kemikali giga, iwọn ọkà kekere, ti o dara recrystallization agbari ati aitasera ninu awọn mẹtaaxes.
O kun lo ni sputtering iwadi oro ti a bo ti opitika okun, wafer semikondokito ati Circuit ese, ibi -afẹde tantalum le ṣee lo fun wiwa cathode sputtering, ga igbale afamora ohun elo ti nṣiṣe lọwọ, ati be be lo.
O jẹ ohun elo pataki fun imọ -ẹrọ fiimu tinrin. Ohun ija ihamọra-lilu: Tantalum ti a ṣe ihamọra-lilu ohun ija jẹ iru misaili kan, gẹgẹbi misaili TOW2B.Ta-10W ati awọn irin miiran le tun ṣee ṣe sinu ohun ija ihamọra-lilu.