Ingoa Hua:Tantalum target material
Kōeke: Ta1.Ta2.TaW2.5.TaW10.
Standard:GB/3629-2006
Pure:≥99.95%
Condition: annealed (M) or hard (Y)
Rahi:
Te diameter o waho (mm) | Matotoru (mm) | Te rarawa o te mata | Paparahi |
50~ 400 | 3~ 50 | 32Rms | ≤0.15% |
Panui: Ko nga hua motuhake me whiriwhiri i waenga i te tohatoha me te hiahia. |
Nga whakaritenga whakauru:
Waitohu | Ihirangi timatanga (hautanga papatipu %) | |||||||||||
C | N | E | H | Fe | Ana | Ni | Koe | Mo | W | Nb | Ta | |
Ta1 | 0.01 | 0.005 | 0.015 | 0.0015 | 0.005 | 0.005 | 0.002 | 0.002 | 0.01 | 0.01 | 0.05 | Toenga |
Ta2 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.02 | 0.005 | 0.005 | 0.03 | 0.04 | 0.1 | Toenga |
TaNb3 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.03 | 0.005 | 0.005 | 0.03 | 0.04 | 1.5~ 3.5 | Toenga |
TaNb20 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.03 | 0.005 | 0.005 | 0.02 | 0.04 | 17~ 23 | Toenga |
TaNb40 | 0.01 | 0.01 | 0.02 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 0.05 | 35~ 42 | Toenga |
TaW2.5 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 2.0~ 3.5 | 0.5 | Toenga |
TaW7.5 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 6.5~ 8.5 | 0.5 | Toenga |
TaW10 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 9.0~ 11 | 0.1 | Toenga |
Tono: Ko te whaainga sputtering Tantalum he pepa tantalum i whakawhiwhia mai e te tukatuka pehanga, me te maamaa o te matū tiketike, iti te rahi o te witi, he pai te whakaritenga whakahoahoa me te riterite ki nga muka e toru.
Matua whakamahia i roto i sputtering putunga paninga o muka whatu, paraoa semiconductor me te ara iahiko whakauru, Ka taea te whakamahi i te whaainga tantalum mo te whakakikorua i te cathode sputtering, rauemi māhinu tiketike ngongo tiketike, etc..
He taonga nui mo te hangarau kiriata angiangi. He matā-weronga patu: Ko te paura patu-patu-patu-patu he momo missile, penei i te miihini TOW2B. Ka taea hoki te hanga i te ti-10W me etahi atu koranu hei kariri.