Aha ngwaahịa:Tantalum target material
Ọkwa: Ta1.Ta2.TaW2.5.TaW10.
elu nkenke ebu:GB/3629-2006
Ịdị ọcha:≥99.95%
Condition: annealed (Nna -ukwu) or hard (Y)
Nha:
Dayameta dị n'èzí (mm) | Ọkpụrụkpụ (mm) | Ọdịdị nke elu | Ụtọ |
50~ 400 | 3~ 50 | 32Rms | 0.15% |
Rịba ama: Ọ dị mkpa ka a kpaa nkata n'etiti ngwaahịa na ihe achọrọ. |
Ihe achọrọ chọrọ:
Akara | Ọdịnaya mmewere (oke nta %) | |||||||||||
C | N | Ọ | H | Fe | Na | Ni | Ị | Mo | W | Nb | Ta | |
Ta1 | 0.01 | 0.005 | 0.015 | 0.0015 | 0.005 | 0.005 | 0.002 | 0.002 | 0.01 | 0.01 | 0.05 | Ihe fọdụrụ |
Ta2 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.02 | 0.005 | 0.005 | 0.03 | 0.04 | 0.1 | Ihe fọdụrụ |
TaNb3 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.03 | 0.005 | 0.005 | 0.03 | 0.04 | 1.5~ 3.5 | Ihe fọdụrụ |
TaNb20 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.03 | 0.005 | 0.005 | 0.02 | 0.04 | 17~ 23 | Ihe fọdụrụ |
TaNb40 | 0.01 | 0.01 | 0.02 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 0.05 | 35~ 42 | Ihe fọdụrụ |
TaW 2.5 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 2.0~ 3.5 | 0.5 | Ihe fọdụrụ |
TaW7.5 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 6.5~ 8.5 | 0.5 | Ihe fọdụrụ |
TaW10 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 9.0~ 11 | 0.1 | Ihe fọdụrụ |
Ngwa: Ebumnuche tantalum na -agbasa bụ mpempe akwụkwọ tantalum nwetara site na nhazi nrụgide, na akwa kemịkal dị elu, obere mkpụrụ ọka, ezigbo nzukọ nchigharị na ịdị n'otu n'ime atọxes.
Tumadi eji sputtering deposition mkpuchi nke ngwa anya eriri, semiconductor wafer na sekit agbakọtara, Enwere ike iji ebumnuche tantalum maka mkpuchi mkpuchi cathode, akwa agụụ mmiri ihe na -arụ ọrụ, wdg.
Ọ bụ ihe dị mkpa maka teknụzụ ihe nkiri dị gịrịgịrị. Mgbọ agha na-akụ agha: Mgbapụ na-adọkpụ ngwa agha nke Tantalum mere bụ ụdị ogbunigwe, dị ka ogbunigwe TOW2B.Ta-10W na alloys ndị ọzọ nwekwara ike mee mgboagha na-adụpu ihe agha..