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Magnetron sputtering lub hom phiaj

2021年10月29日

1) Lub hauv paus ntsiab lus ntawm Magnetron sputtering.
Nyob rau hauv lub sputtered phiaj ncej (cov cathode) thiab lub anode ntawm qhov sib ntxiv ntawm ib qho orthogonal magnetic thiab hluav taws xob teb, nyob rau hauv lub tshuab nqus tsev siab uas muaj cov nkev inert xav tau (feem ntau yog Ar gas), cov hlau nplaum ruaj khov nyob rau hauv lub hom phiaj cov ntaub ntawv nto los ua ib qho chaw sib nqus ntawm 250 ~ 350 gauss, nrog rau high voltage hluav taws xob teb los tsim ib qho orthogonal electromagnetic teb. Nyob rau hauv qhov kev txiav txim ntawm hluav taws xob teb, Ar gas yog ionised rau hauv zoo ions thiab electrons, lub hom phiaj yog ntxiv nrog qee qhov tsis zoo siab voltage, cov electrons los ntawm lub hom phiaj yog raug rau qhov kev txiav txim ntawm lub magnetic teb thiab ionisation ntawm cov roj ua hauj lwm nce., Lub siab ceev plasma yog tsim nyob ze ntawm lub cathode, Lub Ar ions tau nrawm nyob rau hauv qhov kev txiav txim ntawm Lorentz quab yuam thiab ya mus rau lub hom phiaj nto, bombarding lub hom phiaj nto nrog ib tug heev ceev ceev, kom cov atoms sputtered tawm ntawm lub hom phiaj ua raws li lub hauv paus ntsiab lus ntawm momentum conversion nrog ib tug siab The atoms sputtered rau lub hom phiaj ua raws li lub kinetic zog conversion txoj cai thiab ya tawm ntawm lub hom phiaj nto ntawm lub substrate rau deposit ib zaj duab xis.. Magnetron sputtering feem ntau muab faib ua ob hom: DC sputtering thiab RF sputtering, qhov twg lub hauv paus ntsiab lus ntawm DC sputtering khoom yog yooj yim thiab tus nqi yog ceev thaum sputtering hlau. RF sputtering muaj, ntawm qhov tod tes, tuaj yeem siv rau hauv ntau yam kev siv thiab tuaj yeem sputter cov ntaub ntawv tsis-conductive ntxiv rau cov khoom siv hluav taws xob, nrog rau reactive sputtering rau kev npaj cov ntaub ntawv sib xyaw xws li oxides, nitrides thiab carbides. Yog hais tias qhov zaus ntawm RF yog nce, nws yuav ua rau microwave plasma sputtering, hnub no, feem ntau siv yog electron cyclotron resonance (ECR) hom microwave ntshav sputtering.
2) Hom magnetron sputtering lub hom phiaj.
Hlau sputtering txheej phiaj, alloy sputtering txheej phiaj, ceramic sputtering txheej phiaj, boride ceramic sputtering lub hom phiaj, carbide ceramic sputtering lub hom phiaj, fluoride ceramic sputtering lub hom phiaj, nitride ceramic sputtering phiaj, oxide ceramic phiaj, selenide ceramic sputtering lub hom phiaj, silicide ceramic sputtering lub hom phiaj, sulfide ceramic sputtering lub hom phiaj, telluride ceramic sputtering lub hom phiaj, lwm lub hom phiaj ceramic, chromium-doped silicon oxide ceramic lub hom phiaj (Cr-SiO), indium phosphide cov hom phiaj (InP), ua cov hom phiaj arsenide (PbAs), indium arsenide lub hom phiaj (Nyob hauv). [2]
Application Areas Editor Suab
Raws li peb txhua tus paub, kev txhim kho thev naus laus zis ntawm cov ntaub ntawv phiaj xwm zoo sib xws nrog kev txhim kho ntawm cov tshuab thev naus laus zis hauv kev lag luam downstream, thiab raws li daim ntawv thov kev lag luam txhim kho cov thev naus laus zis hauv cov khoom siv zaj duab xis nyias lossis cov khoom siv, lub hom phiaj khoom siv thev naus laus zis kuj tseem yuav hloov pauv. Piv txwv, Ic manufacturers. Nyob rau hauv tsis ntev los no lub sij hawm mob siab rau txoj kev loj hlob ntawm tsawg resistivity tooj liab thaiv, cia siab tias yuav hloov pauv qhov qub aluminium zaj duab xis nyob rau ob peb xyoos tom ntej no, yog li ntawd txoj kev loj hlob ntawm lub hom phiaj tooj liab thiab lawv qhov yuav tsum tau muaj kev thaiv txheej txheej cov khoom siv yuav tsum ceev. Ntxiv thiab, nyob rau xyoo tas los no, lub vaj huam sib luag tiaj tus (FPD) hloov pauv qhov qub cathode ray tube (CRT) raws li lub computer saib thiab TV lag luam. Nws kuj tseem yuav ua kom cov thev naus laus zis thiab kev lag luam xav tau rau ITO cov hom phiaj. Ntxiv thiab, nyob rau hauv cov khoom siv technology. High-density, muaj peev xwm hard disk, high-density rewritable optical disc thov tseem nce ntxiv. Tag nrho cov no tau ua rau muaj kev hloov pauv hauv daim ntawv thov kev lag luam xav tau cov khoom siv. Hauv qab no peb yuav qhia txog qhov tseem ceeb ntawm daim ntawv thov ntawm cov khoom siv, thiab cov qauv ntawm lub hom phiaj kev txhim kho cov khoom siv hauv cov cheeb tsam no.
Microelectronics
Kev lag luam semiconductor muaj qhov xav tau zoo tshaj plaws rau lub hom phiaj sputtering films ntawm txhua daim ntawv thov kev lag luam. Hnub no, silicon wafers txog li 12 ntiv tes (300 epitodes) yog tsim. thaum qhov dav ntawm kev sib tshuam yog txo qis. Cov kev cai ntawm silicon wafer manufacturers rau qhov ntau thiab tsawg, siab purity, Kev sib cais qis thiab cov nplej zoo yuav tsum tau ua kom cov hom phiaj tsim muaj lub microstructure zoo dua. Lub crystalline particle txoj kab uas hla thiab uniformity ntawm lub hom phiaj tau raug txheeb xyuas tias yog ib qho tseem ceeb cuam tshuam rau cov deposition npaum li cas ntawm cov zaj duab xis.. Ntxiv thiab, lub purity ntawm zaj duab xis yog heev nyob ntawm qhov purity ntawm lub hom phiaj. Yav tag los, a 99.995% (4N5) Lub hom phiaj tooj liab ntshiab tuaj yeem ua tau raws li qhov xav tau ntawm cov tuam txhab semiconductor rau 0.35 teev tsaus ntuj, tab sis nws tsis tuaj yeem ua tau raws li qhov xav tau ntawm cov txheej txheem niaj hnub no 0.25um, ua 0,18um} kos duab los yog txawm 0.13m txheej txheem rau cov unmetered yuav xav tau lub hom phiaj purity ntawm 5 lossis txawm tias 6N lossis ntau dua. Tooj piv nrog aluminium, tooj liab muaj kev tiv thaiv ntau dua rau electromigration thiab qis dua resistivity kom tau raws li! Tus neeg xyuas pib txheej txheem yuav tsum muaj cov kab hluav taws xob me me hauv qab 0.25um tab sis coj nrog nws lwm yam teeb meem: lub zog adhesion ntawm tooj liab rau cov ntaub ntawv organic dielectric yog tsawg. Thiab yooj yim rau hnov, ua rau kev siv cov nti tooj liab interconnection kab yog corroded thiab tawg. Yuav kom daws tau cov teeb meem no, qhov yuav tsum tau teeb tsa ib txheej txheej ntawm cov tooj liab thiab dielectric txheej. Thaiv txheej cov ntaub ntawv feem ntau yog siv siab melting point, siab resistivity ntawm cov hlau thiab nws cov tebchaw, yog li lub thickness ntawm txheej thaiv yog tsawg dua 50nm, thiab tooj liab thiab dielectric khoom adhesion kev ua tau zoo. Copper interconnection thiab aluminium interconnection ntawm cov khoom thaiv txheej yog txawv. Cov hom phiaj tshiab yuav tsum tau tsim. Copper interconnection ntawm thaiv cov txheej txheem nrog cov khoom siv nrog rau Ta, W, Tas, WSi, lwm yam.. Mas Ta, W yog cov hlau refractory. Kev tsim khoom yog qhov nyuaj, tam sim no tab tom kawm molybdenum, chromium thiab lwm yam Taiwan kub ua lwm yam ntaub ntawv.
Rau kev nthuav qhia
Cov vaj huam sib luag tiaj tus (FPD) tau muaj kev cuam tshuam loj rau lub khoos phis tawj saib thiab TV ua lag luam xyoo dhau los, feem ntau nyob rau hauv daim ntawv ntawm cathode ray hlab (CRT), uas tseem yuav tsav cov thev naus laus zis thiab kev lag luam xav tau rau ITO cov hom phiaj. Muaj ob hom iTO lub hom phiaj muaj hnub no. Ib qho yog siv nano-xeev indium oxide thiab tin oxide hmoov sib xyaw thiab sintered, ib qho yog siv indium tin alloy phiaj. Indium-tin alloy lub hom phiaj tuaj yeem siv rau ITO nyias zaj duab xis los ntawm DC reactive sputtering, tab sis lub hom phiaj nto yuav oxidise thiab cuam tshuam tus nqi sputtering, thiab nws tsis yooj yim kom tau txais qhov loj me ntawm Taiwan kub lub hom phiaj. Tam sim no, thawj txoj kev feem ntau yog siv los tsim ITO lub hom phiaj, siv L}IRF reactive sputtering txheej. Nws muaj qhov ceev deposition ceev. Thiab muaj peev xwm tswj tau qhov tuab ntawm zaj duab xis, siab conductivity, zoo sib xws ntawm zaj duab xis, thiab muaj zog adhesion rau lub substrate, lwm yam. l. Tab sis lub hom phiaj cov ntaub ntawv ntau lawm nyuaj, uas yog vim indium oxide thiab tin oxide tsis yooj yim rau sinter ua ke. ZrO2, Bi2O3 thiab CeO feem ntau yog siv los ua sintering additives thiab muaj peev xwm tau txais cov hom phiaj nrog qhov ceev ntawm 93% rau 98% ntawm theoretical tus nqi. Kev ua tau zoo ntawm ITO cov yeeb yaj kiab tsim nyob rau hauv txoj kev no yog nyob ntawm cov khoom siv ntxiv. Cov kws tshawb fawb Nyij Pooj siv Bizo ua ib qho ntxiv, Bi2O3 melts ntawm 820Cr thiab tau volatilised tshaj qhov kub ntawm sintering ntawm l500 ° C. Qhov no ua rau lub hom phiaj ITO ntshiab kom tau txais nyob rau hauv cov kua theem sintering. Ntxiv mus, oxide raw khoom yuav tsum tsis tas yuav tsum yog nanoparticles, uas ua kom yooj yim rau cov txheej txheem ua ntej. Hauv 2000, National Development Planning Commission, Ministry of Science thiab Technology Ministry of Science thiab Technology nyob rau hauv “tam sim no qhov tseem ceeb ntawm txoj kev loj hlob ntawm cov ntaub ntawv kev lag luam tseem ceeb cov lus qhia”, ITO cov ntaub ntawv loj lub hom phiaj kuj suav nrog.
Rau khaws cia
Hauv kev khaws cia technology, kev loj hlob ntawm high-density, high-muaj peev xwm hard disk yuav tsum muaj coob tus loj magnetoresistive zaj duab xis cov ntaub ntawv, thiab CoF ~ Cu multilayer composite zaj duab xis yog dav siv loj magnetoresistive zaj duab xis qauv niaj hnub no. TbFeCo alloy lub hom phiaj cov khoom xav tau rau cov hlau nplaum discs tseem tab tom tsim ntxiv, thiab cov magnetic discs ua los ntawm nws muaj peev xwm cia siab, lub neej ntev thiab tuaj yeem rov ua dua yam tsis muaj kev sib cuag. Cov hlau nplaum discs tsim niaj hnub no muaj txheej txheej zaj duab xis sib xyaw ntawm TbFeCo / Ta thiab TbFeCo / Al. Kerr tig lub kaum sab xis ntawm TbFeCo / AI qauv ncav cuag 58, thaum TbFeCofFa tuaj yeem nyob ze 0.8. Nws tau pom tias qhov tsawg sib nqus permeability ntawm lub hom phiaj cov khoom siab AC ib feem tawm voltage l resists hluav taws xob lub zog.
Germanium antimony telluride raws theem hloov nco (PCM) tau pom tias muaj peev xwm ua lag luam tseem ceeb raws li lwm lub cim xeeb thev naus laus zis rau NOR hom flash thiab ib feem ntawm kev lag luam DRAM, txawm li cas los, ib qho ntawm cov kev sib tw ntawm txoj kev mus rau qhov nrawm dua yog qhov tsis muaj cov kab mob hermetic tag nrho uas tuaj yeem tsim tau los txo qhov rov pib dua tam sim no.. Tsawg rov pib dua tam sim no tuaj yeem txo qis kev siv lub zog nco, ncua roj teeb lub neej thiab nce cov ntaub ntawv bandwidth, tag nrho cov yam ntxwv tseem ceeb rau niaj hnub no cov ntaub ntawv-centric, portable neeg siv khoom heev

 

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