Khoom Lub Npe:Tantalum target material
Qib: Ta1.Ta2.TaW2.5.TaW10.
Standard:GB/3629-2006
Kev dawb huv:≥99.95%
Condition: annealed (M) or hard (Y)
Loj:
Txheej sab nrauv (hli) | Thickness (hli) | Qhov ntxhib | Flatness |
50~ 400 | 3~ 50 | 32Rms | .10.15% |
Nco tseg: Cov khoom tshwj xeeb yuav tsum tau sib tham ntawm cov khoom thiab kev xav tau. |
Cov khoom siv xav tau:
Hom | Cov ntsiab lus tseem ceeb (loj feem %) | |||||||||||
C | N | O | H | Fe | Thiab | Nws | Koj | Mo | W | Nb | Ta | |
Ta1 | 0.01 | 0.005 | 0.015 | 0.0015 | 0.005 | 0.005 | 0.002 | 0.002 | 0.01 | 0.01 | 0.05 | Cov seem |
Ta2 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.02 | 0.005 | 0.005 | 0.03 | 0.04 | 0.1 | Cov seem |
TaNb 3 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.03 | 0.005 | 0.005 | 0.03 | 0.04 | 1.5~ 3.5 | Cov seem |
TaNb 20 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.03 | 0.005 | 0.005 | 0.02 | 0.04 | 17~ 23 | Cov seem |
TaNb 40 | 0.01 | 0.01 | 0.02 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 0.05 | 35~ 42 | Cov seem |
TAWS 2.5 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 2.0~ 3.5 | 0.5 | Cov seem |
TWS 7.5 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 6.5~ 8.5 | 0.5 | Cov seem |
TSW 10 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 9.0~ 11 | 0.1 | Cov seem |
Daim ntawv thov: Tantalum sputtering phiaj yog daim ntawv tantalum tau los ntawm kev ua haujlwm siab, nrog tshuaj lom neeg siab, me me luaj li cas, zoo recrystallization lub koom haum thiab sib xws hauv pebaxes.
Feem ntau siv hauv sputtering deposition txheej ntawm fiber ntau kho qhov muag, semiconductor wafer thiab kev sib xyaw ua ke, lub hom phiaj tantalum tuaj yeem siv rau cathode sputtering txheej, siab nqus nqus cov khoom siv, lwm yam.
Nws yog cov khoom siv tseem ceeb rau kev siv tshuab zaj duab xis nyias. Armor-piercing mos txwv: Tantalum-ua armor-piercing mos txwv yog ib hom foob pob hluav taws, xws li TOW2B missile.Ta-10W thiab lwm cov hlau kuj tseem tuaj yeem ua rau hauv cov cuab yeej siv phom.