Sunan samfur:Tantalum target material
Matsayi: Ta1.Ta2.TaW2.5.TaW10.
Standard:GB/3629-2006
Tsarki:≥99.95%
Condition: annealed (M) or hard (Y)
Girman:
Ƙananan diamita (mm) | Kauri (mm) | Matsalar farfajiya | Flatness |
50~ 400 | 3~ 50 | 32Rms | ≤0.15% |
Lura: Ana buƙatar yin shawarwari tsakanin samfura na musamman tsakanin wadata da buƙata. |
Abubuwan da ake buƙata:
Alama | Abun ciki na asali (babban taro %) | |||||||||||
C | N | O | H | Fe | Kuma | Ni | Kai | Mo | W | Nb | Ta | |
Ta1 | 0.01 | 0.005 | 0.015 | 0.0015 | 0.005 | 0.005 | 0.002 | 0.002 | 0.01 | 0.01 | 0.05 | Sauran |
Ta2 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.02 | 0.005 | 0.005 | 0.03 | 0.04 | 0.1 | Sauran |
TaNb3 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.03 | 0.005 | 0.005 | 0.03 | 0.04 | 1.5~ 3.5 | Sauran |
TaNb20 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.03 | 0.005 | 0.005 | 0.02 | 0.04 | 17~ 23 | Sauran |
TaNb40 | 0.01 | 0.01 | 0.02 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 0.05 | 35~ 42 | Sauran |
TaW2.5 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 2.0~ 3.5 | 0.5 | Sauran |
TaW7.5 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 6.5~ 8.5 | 0.5 | Sauran |
TaW10 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 9.0~ 11 | 0.1 | Sauran |
Aikace -aikace: Tantalum sputtering manufa shine takardar tantalum da aka samu ta hanyar sarrafa matsin lamba, tare da tsabtar sinadarai, karamin hatsi, kyakkyawan ƙungiyar sake kunnawa da daidaituwa a cikin ukuaxes.
Yafi amfani a sputtering shaida shafi na Tantancewar fiber, semiconductor wafer da hadedde kewaye, Tantalum manufa za a iya amfani da cathode sputtering shafi, babban injin tsotsa kayan aiki, da dai sauransu.
Abu ne mai mahimmanci don fasahar fim ɗin bakin ciki. Makamai masu huda makamai: Tantalum da aka kera da makamai masu linzami wani nau'in makami ne, kamar makami mai linzami na TOW2B..