Product Name:Tantalum target material
Grade: Ta1.Ta2.TaW2.5.TaW10.
Standard:GB/3629-2006
Purity:≥99.95%
Condition: annealed (M) or hard (Y)
Size:
Outer diameter (mm) | Thickness (mm) | Surface roughness | Flatness |
50~400 | 3~50 | 32Rms | ≤0.15% |
Note: Special products need to be negotiated between supply and demand. |
Ingredient requirements:
Brand | Elemental content (mass fraction %) | |||||||||||
C | N | O | H | Fe | Si | Ni | Ti | Mo | W | Nb | Ta | |
Ta1 | 0.01 | 0.005 | 0.015 | 0.0015 | 0.005 | 0.005 | 0.002 | 0.002 | 0.01 | 0.01 | 0.05 | Residuals |
Ta2 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.02 | 0.005 | 0.005 | 0.03 | 0.04 | 0.1 | Residuals |
TaNb3 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.03 | 0.005 | 0.005 | 0.03 | 0.04 | 1.5~3.5 | Residuals |
TaNb20 | 0.02 | 0.025 | 0.03 | 0.005 | 0.03 | 0.03 | 0.005 | 0.005 | 0.02 | 0.04 | 17~23 | Residuals |
TaNb40 | 0.01 | 0.01 | 0.02 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 0.05 | 35~42 | Residuals |
TaW2.5 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 2.0~3.5 | 0.5 | Residuals |
TaW7.5 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 6.5~8.5 | 0.5 | Residuals |
TaW10 | 0.01 | 0.01 | 0.015 | 0.0015 | 0.01 | 0.005 | 0.01 | 0.01 | 0.02 | 9.0~11 | 0.1 | Residuals |
Application: Tantalum sputtering target is a tantalum sheet obtained by pressure processing, with high chemical purity, small grain size, good recrystallization organization and consistency in the threeaxes.
Mainly used in sputtering deposition coating of optical fiber, semiconductor wafer and integrated circuit, tantalum target can be used for cathode sputtering coating, high vacuum suction active material, etc.
It is an important material for thin film technology. Armor-piercing ammunition: Tantalum-made armor-piercing ammunition is a kind of missile, such as TOW2B missile.Ta-10W and other alloys can also be made into armor-piercing ammunition.